1. Thermal stability improvement of sintered Ag die-attach materials by addition of transition metal compound particles
   Kazuhiko Sugiura, Tomohito Iwashige, Kazuhiro Tsuruta, Chuantong Chen, Shijo Nagao, Tohru Sugahara, Katsuaki Suganuma
   Applied Physics Letters, 114 [16] (2019) 161903, DOI: 10.1063/1.5094073
2. Alloying and embedding of Cu-core/Ag-shell nanowires for ultra-stable stretchable and transparent electrodes
   Bowen Zhang, Wanli Li, Masaya Nogi, Chuantong Chen, Yang Yang, Tohru Sugahara, Hirotaka Koga, Katsuaki Suganuma
   ACS Applied Materials & Interfaces, 11 [20] (2019) 18540-18547, DOI: 10.1021/acsami.9b04169
3. Jeyun Yeom, Shijo Nagao, Chuantong Chen, Tohru Sugahara, Hao Zhang, Chanyang Choe , Cai-Fu Li, Katsuaki Suganuma
   Appl. Phys. Lett. 114 (2019) 253103, DOI: 10.1063/1.5099140
4. Effects of microstructure of Ni barrier on bonding interface diffusion behaviors of Bi–Te-based thermoelectric material
   Ekubaru Yusufu, Tohru Sugahara, Michio Okajima, Shutaro Nambu, KatsuakiSuganum
   Journal of Alloys and Compounds Volume 817, 15 March 2020, 152731 (2020).DOI : 10.1016/j.jallcom.2019.152731
5. Fabrication and Characterization of Ultra-Lightweight, Compact, and Flexible Thermoelectric Device Based on Highly Refined Chip Mounting,
   Yusufu Ekubaru, Tohru Sugahara, Kenzo Ibano, Aiji Suetake, Maki Tsurumoto,  Noriko Kagami, Katsuaki Suganuma
   Advanced Materials Technologies, 2020, 1901128 (2020). DOI: 10.1002/admt.201901128